GD450 Operation Manual(2015.03.13）

Shenzhen Hetiangude Automation Equipment Co., Ltd.
GD450 Operation Manual
Automatic Vision Printer – Reliable Choice
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Shenzhen Hetiangude Automation Equipment Co., Ltd.
Contents
Charter I System Description………………………………………………………4
1.1 Functional Feature……………………………………………………………4
1.2 Technical Parameter……………………………………………………………5
1.3 Outer Dimension………………………………………………………………6
1.4 Main Component………………………………………………………………6
1.5 Working Principle………………………………………………………………9
Chapter II Equipment Installation and Test…………………………………….10
2.1 Unpacking……………………………………………………………………..10
2.2 Operating Environment………………………………………………………11
2.3 Equipment Placement and Height Adjustment………………………………..11
2.4 Power and Air Supply…………………………………………………………11
2.5 IPC Control System Installation………………………………………………11
2.6 Software Installation…………………………………………………………12
2.6.1 Software Function Introduction……………………………………….12
2.6.2 Software Installation……………………………………………………13
Chapter III Production Process……………………………………………………14
3.1 Pre-start Inspection……………………………………………………………14
3.2 Pre-production Preparation………………………………………………….14
3.2.1 Template Preparation……………………………………………………14
3.2.2 Solder Paste Preparation………………………………………………15
3.2.3 PCB Positioning Test………………………………………………….15
3.2.4 Scraper Pressure and Speed Configuration……………………………..26
3.2.5 De-molding Speed and Length………………………………………….27
3.3 Pilot Production……………………………………………………………..27
3.4 Production Flow Chart………………………………………………………29
Chapter IV Operating System Instruction………………………………………31
4.1 System Startup……………………………………………………………….31
4.2 Main Window Composition…………………………………………………31
4.2.1 Main Toolbar 1 - Function and Operation…………………………….32
4.2.2 Main Toolbar 2 - Function and Operation…………………………….35
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4.2.3 Auxiliary Menu - Function and Operation……………………………40
Chapter V Alarm Handling…………………………………………………….….43
5.1 Equipment Alarm……………………………………………………………..43
5.2 Instruction to Equipment Alarm and Handling Measure……………………..43
Chapter VI Introduction to Newly-added Functions…………………………….49
6.1 2D Solder Paste Detection Instruction………………………………………49
6.2 SPC Data Analysis System Introduction and User Manual…………………54
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Chapter I System Description
1.1 Functional Feature
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Advanced top view/bottom view vision system, independently controlled and adjusted
lighting, high-speed mobile camera, precise PCB and template alignment, ±0.025mm
printing precision;
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High precision servo motor and PC control ensure stable and precise printing; infinite
image mode recognition technology provides ±0.01mm resetting precision;
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Floated printing head is designed with special high-rigid structure; scraper pressure,
speed and stroke are controlled by computer servo, which ensures even and stable
printing quality; scraper beam is designed with special and optimized structure, leading
to light weight and artistic appearance;
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Manual/automatic screen underside cleaning function; automatic and unattended screen
underside cleaning function; programmable dry, wet or vacuum cleaning process;
optional cleaning time interval; completely cleaning solder paste left in screen mesh to
ensure printing quality;
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Assembly-type multifunctional workbench; thimble and vacuum chamber may be set and
installed according to actual size of PCB board, ensuring fast and easy clamping;
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Multifunctional board treatment device is designed to automatically position and clamp
PCB board of all size and thickness; movable magnetic thimble, vacuum platform, and
vacuum chamber effectively avoids board deformation, and ensures uniform printing
process;
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“Windows XP” operating interface and rich software functions; friendly man-machine
interaction environment; easy operation, convenient, easy to learn and easy to use;
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Fault self-diagnosis, light alarm, fault cause prompt, etc.
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Compatible with single/dual-sided PCB board;
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Perfectly print bonding pad with 0.3mm clearance;
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2D detection function (standard function);
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SPC system;
Optional Items: If needing the below optional functions, please contact Hetiangude Automation
Equipment Co., Ltd. Your demand will be satisfied by adding the blow selected prices to the total
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price of basic configuration.
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Close-loop printing head
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Rubber scraper
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Three-sectional track
1.2 Technical Parameter
GD-450™ Technical Specification
PCB Parameter
Maximum Size (X×Y)
450mm×320mm
Minimum Size (Y×X)
50mm×50mm
PCB Thickness
0.4mm~6mm
Warpage
Maximum PCB Diagonal 1%
Maximum Board Weight
6Kg
Board Edge Clearance
Configured to 3mm
Maximum Bottom Clearance
16mm
Transmission Speed
1500mm/s (Max)
Transmission Height to Ground
900±40mm
Direction of Transmission Track
L-R, R-L, L-L, R-R
Transmission Mode
One-sectional Transport Track
Elastic lateral pressure is adjustable in software; bottom multipoint vacuum or
integral vacuum chamber
Magnetic Thimble, Equal Altitude Block, Special Work-piece Clamp
PCB Clamping Mode
Board Supporting Method
Printing Parameter
Printing Head
Driven by two independent directly-connected motors
Template Frame Size
370mm×470mm~737mm×737 mm
Maximum Printing Area (X×Y)
Printing Mode
450mm×320mm
Steel scraper/rubber scraper (Angle: 45°/55°/60° is to be selected according to
printing technique)
Single or dual-scraper printing
De-molding Length
0.02mm to 12mm
Printing Speed
6mm/s to 200mm/s
Printing Pressure
0.5kg to 10Kg
Printing Stroke
±200mm (from center)
Scraper Type
Video Parameter
Video View Field (Field of View)
6.4mm×4.8mm
Platform Adjustment Range
X, Y: ±7.0mm, θ: ±2.0°
Datum Point Type
Datum point of standard shape (see SMEMA standard), bonding pad/borehole
Independent camera, top/bottom view independent video recording vision
system, geometric matching positioning
Video Camera System
Performance Parameter
Repeated Precision of Video
Alignment
Repeated Precision of Printing
±12.5microns (±0.0005”) @6 σ, CPK no lower than 2.0
Circulation Time
Less than 7.5s
±25micros (±0.001”) @6 σ, CPK no lower than 2.0
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Changeover Time
Less than 5mins
Equipment
Power Supply
AC220V±10%, 50/60HZ, 15A
Compressed Air
4~6Kg/cm2, Φ10.0 pipe
Operating System
Windows XP
Equipment Dimension
1140mm (W)×1400mm (L)×1480mm(H)
Weight
1000Kg
Optical System (Fiducially Mark - Optical Alignment Mark)
Fiducial Mark Detection
Alignment Mode
Fiducial Mark Shape
Fiducial Mark Size
Fiducial Mark Type
Fiducial Mark Requirement
Realized by one CCD camera with two fiducial marks on screen and board
A camera is used to detect the position of PCB and screen. Vision correction system
software is designed to correct the position of universal workbench in X-Y-θ
direction, realizing the alignment between screen and board.
Any shape
Boreholes of all shapes with diameter or side length 1mm~2.5mm (allowable
deviation)
Transparent type: thin copper rim
Semi-transparent type: transparent or semi-transparent center, with nickel or bronze
coating
Coating surface of fiducial mark is required to be even and smooth
1.3 Outer Dimension
Fig. 1-1 Outer Dimension of Equipment
1.4 Main Component
The equipment is comprised mechanical and electrical parts:
Mechanical part includes platform alignment system, PCB transmission and positioning system,
video capture system, steel screen automatic positioning and cleaning system, tin scraping
system, pneumatic system, etc. Electrical part consists of electronic control system and control
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software, counter, driver, stepping motor, servo motor, and signal monitoring system.
1.4.1 Platform Alignment System
Components: Z-axis lifting device (base, lead screw, control motor, guide rail, damper, etc.),
platform moving device (lead screw, guide rail, control motors separately for movement along X, Y,
and θ directions), printing workbench (magnetic thimble, vacuum chamber), etc.
Function: drawing support from vision system, the workbench automatically adjust positioning
deviation along X, Y and θ directions, realizing precise alignment between printing template and
PCB board.
1.4.2 PCB Transmission and Positioning System
1.4.2.1 PCB Transmission System
Components: guide rail, belt pulley, flat belt, stepping motor, stop gear, guide rail width adjuster,
etc.
Function: automatically control and adjust PCB board feeding, transmission, stopping position, and
guide rail width, so as to be compatible with PCB boards of different size.
1.4.2.2 PCB Positioning System - Bottom Support
Components: bottom H-shaped integral vacuum chamber, multipoint regional vacuum, magnetic
thimble, equal altitude block, special work-piece clamp (Grid-Lock), etc.
Function: base board edge clamping system improves board treatment to a higher level; in order to
achieve best board clamping force, the pressure of edge clamping system is controlled by software.
The pressure is adjusted to match with the thickness of programmed base board. The solution, along
with top clamping system, steadily clamps base board, providing highest tightness between
template and base board, realizing effective sedimentation of solder paste, and effectively
improving the printing quality.
1.4.3 Video Capture System
Components: CCD moving parts, CCD camera assembly (camera, lighting), and high-resolution
display; the system is controlled by vision system software.
Function: top view/bottom view vision system, independently controlled and adjusted lighting, and
high-speed mobile camera ensure fast and precise alignment between PCB and steel screen; infinite
video mode recognition technical leads to 0.01mm recognition precision.
1.4.4 Steel Screen Automatic Positioning and Cleaning System
1.4.4.1 Steel Screen Automatic Positioning System
Components: screen board moving device and fixing device, etc.
Function: automatic positioning may be realized by merely inputting the position of steel screen
mark point, providing users with the convenience to change between screens of different size.
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Universal steel screen clamping device supports minimum size of 370×470mm, maximum size of
737×737mm, and thickness of 20~40mm
1.4.4.2 Steel Screen Cleaning System - Wiping Module
Components: vacuum tube, Venturi tube, air blower, cleaning fluid tank and sprayer, paper roller,
lifting cylinder, electromagnet, etc. Screen cleaning device is installed on the back of vision system.
Cleaning system is driven by vision system to move and to automatically clean the underside of
screen. During cleaning operation, cleaning paper is lifted, moving closely on the underside of
template. Used cleaning paper is rolled to another roller. The time interval of cleaning may be
configured according to actual demand. The stroke of cleaning may be set according to the stroke of
printing. During wet cleaning, if the cleaning fluid in storage tank is insufficient, there would be
alarm information show by the system. As for this, it is required to refill cleaning fluid. The cycle of
dry, wet and vacuum cleaning may be adjusted freely.
Function: automatic and efficient separation-type cleaning structure, high-power draught fan and
Venturi vacuum generator, spraying system with programmable cleaning fluid spraying process, dry,
wet and vacuum cleaning modes, freely selected and combined cleaning modes; users may set
cleaning frequency, time and speed according to actual demand; easy to be disassembled and
resource-saving; enhanced vacuum to fully make use of draught fan to thoroughly remove residual
solder paste in screen mesh, and to ensure printing quality.
1.4.5 Tin Scraping System
Components: printing head (scraper lifting stroke automatic adjustment device, scraper blade
installation base), scraper beam, scraper driver (servo motor, coupler, lead screw), etc.
Function: Floated weight-balance self-adaption scraper; servo-structure for movement along Y
direction; dual-slider linear guide rail; stable printing process and nimble movement; independent
directly-connected stepping motor; embedded precise pressure control system to accurately measure
the initial pressure of scraper despite of scraper type, length, weight or thickness; programmable
design realizes flexible and various printing process.
1.4.6 Electronic Control System
Components: Windows XP operating system, integrated circuit, intelligent and advanced software
control
Features: safe, easy maintenance, and convenient operation
1.5 Working Principle
When automatic vision printer comprised by the above components is printing solder paste, solder
paste rolls forward under the thrust of scraper. The thrust generated may be decomposed into two
component forces along horizontal and vertical directions. When arriving at the position nearby
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template window, the component force along vertical direction prints solder paste (with viscosity
reduced) on to PCB bonding pad via the window. As for this, precise solder paste pattern is formed
when the platform is lowered down.
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Chapter II Equipment Installation and Test
2.1 Unpacking
After unpacking, please follow the below steps:
1.
Check according to Packing List;
2.
Check if there is damage to the equipment, including display, keyboard, three-colored light,
and scraper board packed in extra package; install these accessories to the printer;
3.
Cut off the fixing ribbon on transmission guide rail;
4.
Fix scraper beam on cross-bar of screen frame, and cut off the fixing belt;
5.
Loosen the fixing sleeve on cross-bar of screen frame, so that the screen frame may move
left and right flexibly;
6.
Remove the fixing board of workbench installed during transportation (as is shown in Fig.
2-1);
7.
Check if there is looseness in every joints, or falling off with transmission belt;
8.
Check if there is loose or falling off slider from guide rail;
9.
Check to ensure all electrical components are properly fixed with sound contact quality;
10. Before startup, please carefully read the Operation Manual;
Workbench Fixing
Board (Red)
Fig. 2-1 Loose Workbench Fixing Board
2.2 Operating Environment
Environment Temperature: The operating temperature of the printer is recommended to be
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23±5℃, no matter there is work-piece in it or not.
Relative Humidity: Operating relative humidity of the equipment shall be lower than 80%.
Storage Condition: Damp-free, dust-free and no direct sunlight; during transportation, please avoid
excessive humidity, shock, pressure, and mechanical impact.
Installation Space: Please refer to outer structure drawing of the equipment.
2.3 Equipment Placement and Height Adjustment
1.
Move and place the printer to expected position; adjust the four legs of the equipment
(adjustable range: ±20mm) to expected height;
2.
Level finding; adjustment steps:
a)
Measure with precise level gauge (frame level);
b)
Adjust the four legs of the equipment, until the equipment of totally leveled;
c)
Fasten the nuts of the four adjustable legs;
2.4 Power and Air Supply
1)
Please use stable power supply of AC 200V 50/60Hz with rated current; if the voltage is
instable, please prepare voltage-stabilized power supply.
2)
Please use industrial air source with stable pressure of 4.5～6kgf/cm2.
Main Power
Supply Port
Air Source
Valve
Main Air
Source Port
Upper/Lower
Connecting Port
Fig. 2-2 Connecting Ports of Power and Air Supply
2.5 IPC Control System Installation
Connect display, keyboard, mouse and other accessories to printer according to Fig. 2-4; connect
the printer with IPC, and switch on the power supply
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Fig. 2-4 Outer Appearance of the Printer
2.6 Software Installation
2.6.1 Software Function Introduction
This is latest GD-450 automatic vision printer control software developed by Hetiangude
Automation Equipment Co., Ltd., with Windows XP operating interface, powerful function, easy
parameter configuration, simple operation, safe and reliable, easy to learn and easy to operate.
The software realizes mechatronic control in GD-450 automatic vision printer, which greatly
improves the automation degree and control precision of printer, and ensures high printing quality.
Software of the equipment has the below functions:
1)
Printing parameter configuration
2)
Equipment parameter configuration
3)
Guide rail width automatic adjustment
4)
Vision system recognition and automatic alignment between steel screen and PCB board
5)
Automatic clamping of screen and PCB board
6)
Automatic cleaning of screen
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7)
I/O fault automatic detection, sound and light alarm, fault cause prompt
8)
Alarm log
9)
Production configuration
10)
Automatic resetting
11)
Online PCB board counting
12)
Automatic steel screen positioning
13)
Automatic scraper altitude measurement
14)
2D solder paste detection and SPC data analysis
15) Vacuum chamber
2.6.2 Software Installation
Before delivery, the equipment has been installed with driver software and operating system. In
actual operation, if the above software needs to be re-installed, please follow the below steps:
1) Put the attached CD in optical disc driver;
2) Open CD, the copy HTGD files to root directory of Disk C of the computer;
3) Open HTGD;
4) After completion, copy the shortcut “
5) Double-click “
” to desktop;
” to open GD-450 driver software;
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Chapter III Production Process
3.1 Pre-start Inspection
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Check if the voltage of power supply and the pressure of air source comply with the
requirements;
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Check if all cables of the equipment have been properly connected;
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Check if the equipment is reliably grounded;
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Check to avoid air leakage with pneumatic system, and to eliminate water accumulated in
filter at air inlet, so as to ensure normal operation;
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Check if the tightness of transmission belts is appropriate;
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Check if there are chippings left in electric cabinet, and if wires in electric cabinet are
properly connected;
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Check if there is tool or other matters left in the equipment;
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Prepare according screen and solder paste according to PCB board to be printed;
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Check if magnetic thimble and vacuum sucker are placed on workbench according to the
size of PCB to be processed;
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Check if cleaning paper is properly installed and check the liquid level of alcohol
reservoir (the liquid level shall be higher than liquid sensor);
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Check if emergency stop button is restore;
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Check if the three-colored light works normally, and make sure the front and rear cover
of the equipment is placed on;
3.2 Pre-production Preparation
3.2.1 Template Preparation
1)
The thickness of template material and the size of template window directly determines the
printing quality of solder paste, which may further affects product quality. Templates shall
be abrasion resistant, with no burr or saw tooth at boreholes. The wall of borehole shall be
smooth. Solder paste shall be highly permeable. Screen board shall be low in extensibility,
and good at resilience.
2)
Screen frame support board shall be moved according to the size of screen frame: align the
center of screen frame with “0” point on the scale of printer front beam and support board,
and then fasten the board;
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Fig. 3-1 Align Screen Frame Center with the Arrow Position
Remarks: 650×550mm screen frame is recommended for the equipment (please refer to screen
frame size recommended in Attachment 1 of User Manual).
3.2.2 Solder Paste Preparation
1)
In SMT, solder paste is one of the key factors affecting product quality. Solder paste
determines maximum printing speed. Viscosity, humidity, and metal powder grain size in
solder paste affect the final printing quality.
2)
Solder paste shall be selected according to actual cleaning mode, solderability of component
and circuit board, clad layer of bonding pad, pin pitch, user demand, etc.
3)
Selected solder paste shall be used according to attached Operation Manual.
4)
Before operation, solder paste shall be stirred uniformly until forming thick paste, and shall
be able to drop by sections when being stirred up by scraper.
5)
Solder paste shall not be used when just being taken out from freezer. It is required to wait
for recovery of its temperature under 25℃ room temperature (please refer to Operation
Manual for detailed information). Solder paste shall not be opened for operation until its
temperature is restored to room temperature.
6)
In practical application, solder paste shall be uniformly coated on the template in front of
scraper, and the coating range shall exceed the opening of template, so as to ensure that
solder paste be printed on all bonding pad of PCB board via screen opening.
3.2.3 PCB Positioning Test
1.
Turn on main power supply of the equipment;
2.
Open main operating interface of the printer, as is shown in Fig. 3-2;
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Fig. 3-2 Open the Main Interface of Software
3.
The equipment will be automatically reset. Click [Exit] button, the equipment exits resetting
mode; click [Start Resetting] button, the equipment enters resetting process and
automatically detects whether there is PCB board in the equipment, as is shown in Fig. 3-3.
If there is PCB in the equipment, please remove the PCB under current state and prompt, and
then click [Confirm] button. The equipment starts resetting until completion, as is shown in
Fig. 3-4.
Fig. 3-3 PCB Detected in Equipment during Reset and Waiting to be Removed
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Fig. 3-4 Return to Zero
4.
Click [Exit] in Fig. 3-4 or click [
] button in main menu to launch the interface shown
in Fig. 3-5; select “Level 3 User”, input password “htgd”, and click OK. “Level 3 User”
environment is activated.
User level introduction:
Level 1 is the lowest, which may be used to invoke old programs and to execute production
operations.
Level 2 has all privileges, except for equipment parameter and scraper configuration.
Level 3 has the privilege to modify equipment parameter 3, 4 and scraper configuration.
Fig. 3-5 (Choose User Level and Input Password)
5.
Click [
] button, as is shown in Fig. 3-6, to create a new program, such as “test”; input
the file name and click [Confirm]. Configuration of “test” program is activated, as is shown
in Fig. 3-7, 3-8, and 3-9.
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Fig. 3-6 Name of PCB to be Produced
6.
In Fig. 3-7, please input three parameters of PCB under the PCB Configuration column:
length as 200, width as 100, and thickness as 1.6.
Other parameters have default values, which may be modified according to actual production
requirement.
7.
Click [
] button to launch the interface shown in Fig. 3-8, and click [Confirm]
button to launch the interface in Fig. 3-9. The interface is mainly designed to configure
parameters related with template alignment.
Fig. 3-7 Input Geometric Dimension of PCB and Modify other Default Parameters if Necessary
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Fig. 3-8
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Fig. 3-9 Mark Point Alignment
Remarks:
A. [Steel Screen Mark 1]: Click to align Steel Screen Mark 1;
B. [PCB Mark 1]: Click to align PCB Mark 1;
C. [Steel Screen Mark 2]: Click to align Steel Screen Mark 2;
D. [PCB Mark 2]: Click to align PCB Mark 2;
E. [Width Adjustment]: To adjust the width of transmission guide rail;
F. [Relocate Baffle Cylinder]: Relocate CCD to designed coordinates;
G. [Screen Frame Standing Valve]: In automatic positioning of steel screen, click the button to
release steel screen support; manually relocate steel screen support to expected position, and
fasten tightly;
H. [Steel Screen Positioning]: In automatic positioning of steel screen, steel screen cylinder will
move along with scraper beam to expected position and then stretch out cylinder rod; plug
steel screen to cylinder rod position and click [Confirm]; the system will re-lock steel
screen.
I. [Fine Adjustment of Steel Screen]: If steel screen is not correctly positioned, click the button
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and adjust the position of steel screen cylinder with mouse.
J. [Scraper Retreat]: Retreat scraper to starting position, which may be used in manual alignment;
K. [Z-axis Ascending]: Z-axis ascends to printing position. The function is to be used in manual
steel screen alignment, with the objective to check if bonding pad and screen borehole are
correctly aligned.
L. [CCD Reset]: Click to reset CCD back to original point, which may be used in manual
alignment of steel screen.
M. [Mark Point Configuration]: Click to edit PCB mark point;
N. [Z-axis to Video Position]: Click to raise Z-axis to video position, which may be used in
manual alignment of steel screen;
O. [Automatic Positioning]: Click the button and the equipment realizes automatic PCB
positioning. The button is frequently used. Normally, the button is pressed after having set
the distance from PCB mark point to border, and the equipment will automatically execute
the below steps: resetting of stopping cylinder, opening of PCB board pressing device, PCD
transmission, PCB in position, Z-axis ascends to video position, lateral clamping, closing of
PCB board pressing device, resetting of stopping cylinder, and CCD returns to original
position. So far, PCB positioning is completed. The next step is alignment between PCB
board and steel screen mark point.
a. (Baffle Cylinder): Open/close board stopping cylinder;
b. (Transmission Switch): Turn on/off transmission belt;
c. (Pressing Plate In-position): Activate/remove guide rail pressing plate;
d. (Platform Ascending): The platform lifts PCB up to video position;
e. (Platform Descending): The platform ascends from video position to PCB feeding position
(Z-axis returns to original point);
f. (Clamping of Guide Rail): Open/close guide rail to clamp PCB;
g. (PCB Sucker Valve): Enable/disable vacuum sucker/chamber to hold PCB;
h. (Screen Frame Fixing Valve): Open/close steel screen fixing cylinder and clamping cylinder;
8.
In Fig. 3-9, the four circles in white box of upper left corner refer to four mark points of PCB
or steel screen. Normally, two diagonal points are selected for alignment. Under ordinary
situation, in order to ensure mark point in CCD vision range, we need to input the distance
from mark point to border, as is shown in Fig. 3-10 and 3-11.
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Fig. 3-10 Distance from PCB Mark Point to Border
Fig. 3-10 shows distance from PCB mark point to border; input the distance and then search PCB
mark point, so that the input PCB mark point will be directly shown in field of vision.
Fig. 3-11 Input the Distance from PCB Mark Point to Border, and Refer to Fig. 3-10 for Correlation
of Dimension
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Fig. 3-12 PCB Positioning
Attention: Input the distance from PCB mark point to border, and place PCB at the entrance of
transmission rail; click [Automatic Positioning], PCB will be automatically transmitted to
expected position, being fixed and clamped firmly. As is shown in Fig. 3-12, click [Z-axis
Ascending] to lift PCB up to steel screen position; open screen frame fixing valve; place steel
screen in position, and align the screen with PCB.
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Fig. 3-13 Click [Mark Point Configuration] to Edit Mark Point
Fig. 3-14 Mark Point Configuration Saving Interface, Click to Return to Main Interface
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Fig. 3-15 Click [PCB Mark 1] in Fig. 3-13 to launch the interface; PCB mark point will be shown in
the field of vision; click [Automatic Finding] to locate mark point, as is shown in the figure
Notes: Introduction to functional buttons:
A. [Platform Adjustment]: click and input password to adjust the altitude and position of
platform;
B. [CCD Adjustment]: move the position of CCD;
C. [LED 1, 2, 3, 4]: adjust the brightness of LED light;
D. [Manual Speed]: the speed of moving CCD with arrow keys on keyboard;
E. [Alignment Similarity]: mark point matching degree; higher score leads to more difficult
recognition and higher precision, and vice versa.
F. [Target Position]: modify the parameters and click [Move]; CCD will move to according
coordinates;
G. [Current Position]: to display current coordinates of CCD;
H. [CCD Resetting]: click the button to reset CCD back to original position;
I. [Move]: click the button to relocate CCD from [Current Position] to [Target Position];
J. [Mark Point Type]: 5 optional types;
K. [Auto Finding]: the system automatically identifies mark points of configured type;
L. [Template Control]: to set the search range; manually set mark point when auto finding
fails;
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M. [Real-time Display]: to display image real-timely, and to be used in manual configuration
of mark point;
N. [Video Capture]: to capture current image, and to be used in manual configuration of
mark point;
O. [Search Field]: select an area from the field of vision, and click the button to set the area
as search field; as for this, the system only identifies mark points in the range; the
function is used when there are two or more similar mark points in the field of vision,
which is designed to filter out unnecessary mark points.
P. [Template Configuration]: identify an image range in field of vision, and click the button
to identify the image range as mark point template;
Q. [Template Customization]: to set selected image range as mark point template;
Fig. 3-16 Alignment of Steel Screen Mark Point and Click [Confirm]
9. Adjust the brightness of Led 1 and Led 2 in Fig. 3-15, so as to differentiate mark from
background color; mark points shall be clear in outline, with easily differentiated white and
black color. On this basis, click [Auto Find] button, and the system will automatically capture
mark points; click [Confirm] to end capture of mark point, and to return to the interface shown
in Fig. 3-13. Capture of mark points in [Steel Screen Mark 1] [PCB Mark 2] [Steel Screen Mark
2] is exactly the same with that in [PCB Mark 1].
10. When mark point alignment between steel screen and PCB is completed, click [Confirm] button
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Shenzhen Hetiangude Automation Equipment Co., Ltd.
in Fig. 3-13 to open the interface shown in Fig. 3-14, and then click [Yes] to return back to the
main interface. So far, mark point alignment is completed.
3.2.4 Scraper Pressure and Speed Configuration
Scraper pressure and speed are two important process factors in steel screen printing.
Scraper Speed: The parameter is configured according to viscosity of scraper and minimum SMD
pin pitch on PCB board. If solder paste is of high viscosity, the speed shall be reduced, and vice
versa. Scraper speed shall be tested from lower pressure, and the pressure shall be improved
slowly, until reaching best solder paste printing quality. The range is speed is 15~50mm/s. If the
printed pitch is fine, scraper speed shall be properly reduced, normally 15~30m/s, so as to
increase the standing time of solder paste at screen windows, and to print more solder paste on
PCB bonding pad. When printing electrical apparatus elements of wide pitch, the speed may set
at 30~50mm/s. (>0.5mm pitch - wide; <0.5mm pitch - fine)
The allowed scraper speed range of the equipment is 0~200mm/s.
Scraper Pressure: Pressure directly affects printing quality. Pressure parameter shall be properly
set to ensure sharp solder paste edge, flat surface, and appropriate thickness. Low pressure and
inadequate solder paste may lead to rosin joint. Excessive pressure leads to adhesion and
bridging of solder paste. As for this, scraper pressure is normally set at 0.5~10kg.
3.2.5 De-molding Speed and Length
De-molding Speed: The parameter refer to the speed of separating board from template after
printing; before solder paste is completely parted from template, de-molding speed shall be low.
When solder paste is completely separated, the board may be lowered down quickly. Slow
de-molding helps to form sharp edge around solder paste, which is especially important for fine
pitch printing. De-molding speed is normally set at 3mm/s. Over-high speed may damage the
shape of solder paste.
The allowed de-molding speed of the equipment is 0~20mm/s.
Time of Separation between PCB and Template: i.e. the time needed to separate board from
template at configured de-molding speed; if the time is excessively long, there would be easily
residual solder paste left on underside of template. Excessively short time is not good for
standing of solder paste. The time is normally controlled at 1s or so.
The equipment controls the variable with de-molding length, which is normally set at 0.5~2mm.
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Shenzhen Hetiangude Automation Equipment Co., Ltd.
The allowed range of the equipment is 0~10mm.
3.3 Pilot Production
If the above preparations are done, trial printing of PCB board may be started. Operating Steps:
1.
Click [
] button in main toolbar to show the interface in Fig. 3-18; enable Adjustment
Window via the interface and click [Confirm] button to return to main interface of the
software.
2.
Click [
] button in the interface, and the software will enter Production Mode according
to related instructions; after the equipment completing PCB transmission, positioning, video
capture, and Z-axis ascending, the interface in Fig. 3-19 is displayed.
3.
In the interface shown in Fig. 3-19, it is required to check if PCB sticks closely to steel
screen. Or else, adjust the height of Z-axis, until complying with the requirement. Check if
PCB bonding pad is coincident with steel screen mesh; if not, adjust X, Y1, and Y2 of the
platform.
Install scraper in the interface of Fig. 3-19; Attention: before installation, please check if the
blade of scraper is straight and flat, avoiding defects.
4.
When all the above works are done, click [Confirm] button to complete printing of the first
PCB.
5.
If the printing quality does not meet the requirement, please re-configure the parameters, or
click [
] button in the main interface to launch the interface shown in Fig. 3-18, and
then input platform and printing error compensation value; if the printing quality meets the
requirement, production may be started.
6.
Solder paste printing quality requirements:
The thickness of solder paste shall be 0.1-0.3mm, and over 75% bonding pad shall be
covered by solder paste, so as to meet the quality requirement.
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Shenzhen Hetiangude Automation Equipment Co., Ltd.
Fig. 3-18 Production Configuration Interface
Fig. 3-19 Fine Adjustment
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Shenzhen Hetiangude Automation Equipment Co., Ltd.
3.4 Production Flow Chart
HTGD System Operation Process
2011.10.06 First Version
1. Green Arrow – main process;
2. Blue Arrow – interrupt operation when the Equipment is under normal operation;
3. Yellow Arrow – judgement operation;
4. Magenta Arrow – automatic loop operation;
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Shenzhen Hetiangude Automation Equipment Co., Ltd.
Switch on External Power Supply
Open External Air Source
Switch on Main Power of the Equipment
Double-click “HTGD” Icon to Launch the Software
Click Return-to-Zero Button to
Reset the Equipment
Equipment Failure
User
User Login
Click “User” Button and Select
User Level to Login
Ready
PCB Feeding
Project File
Loop
Production
Click
“Open”
and Select
the File
Software Interface &
Equipment Panel
Remove the Fault and
Press “Reset” Button
PCB Positioning
Click “Create” to Create
a Project File
Vision Alignment
Modification
Required or Not
Yes Click “Process” to Configure Parameters,
such as PCB Parameter, Steel Screen
Parameter, Process Parameter, etc.
No
Click
“Stop” to
Stop
Production
Set Correct
Compensation Yes
in Deviation
Adjustment
Interface
Deviation
Scraper
Click “Start Production” to
Add Solder Paste, to Adjust
Guide Rail Width
Install
Scraper in
Deviation
Adjustment
Interface
and Test the
Height
No
Printing
Separation
NG
Modify Process
Parameter in
Production
Modify Production
Parameter in
Production
Press “Start/Stop”
Button on
Equipment Panel
to Stop Production
Click “Process” to
Configure Parameters,
such as PCB Parameter,
Steel Screen Parameter,
Process Parameter, etc.
Click “Configuration”
Button to Modify
Production Parameter
Quality
Screen
Cleaning
Press “Start/Stop”
Button on Equipment
Panel to Restore
Production
Click “Stop
Production”
Click “Exit”
System
Switch off Main Power of the Equipment
Close External Air Source
Switch off External Power Supply
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Shenzhen Hetiangude Automation Equipment Co., Ltd.
Chapter IV Operating System Instruction
4.1 System Startup
Turn on main power supply of the equipment to launch the main interface, and the operating steps
are shown below:
Turn on the Main Power Supply
Switch of the Equipment
Turn on Air Supply Valve
Enter the Main Interface of the Equipment (Main Menu)
4.2 Main Window Composition
Main Toolbar 1
Fig. 4-1 Main Interface
Main interface is comprised by two parts:
u Main Toolbar 1
u Main Toolbar 2
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Turn on the Main Power
Main Toolbar 2
Shenzhen Hetiangude Automation Equipment Co., Ltd.
4.2.1 Main Toolbar 1 - Function and Operation
1.
: User Privilege – Different users have different privilege:
Fig. 4-1 (User Configuration Interface)
2.
: Steel Screen Cleaning – If automatic cleaning is unable to meet process
requirement, users may click the button to activate manual cleaning. After
cleaning, the system returns to main interface.
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Shenzhen Hetiangude Automation Equipment Co., Ltd.
Fig. 4-2 (Steel Screen Cleaning)
3.
: Scraper Retreat – Click the button to move scraper back o original point;
4.
: Scraper Forward – Click the button to move scraper to end point;
5.
: I/O Control – Click the button to show the interface in Fig. 4-3, and the
function is designed to check if I/O of the equipment is normal.
Fig. 4-3 I/O Test
6.
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: Movement Control – The function is mainly designed during equipment test
Shenzhen Hetiangude Automation Equipment Co., Ltd.
or trouble shooting. Click the button to show the interface in Fig. 4-4. Fill data
in according blank of the interface, and click [I] button on the right, the
corresponding axis will move to the position configured by the data.
Fig. 4-4 Movement Control
4.2.2 Main Toolbar 2 - Function and Operation
1.
: Create Project – Create a new printing program; click the button, input project
number in the interface shown in Fig. 3-6, and click [Confirm]; edit the program
according to the steps instructed in Chapter III.
2.
: Open Project – Open a project created previously, as is shown in Fig. 4-5; select
the project and click [Open];
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Shenzhen Hetiangude Automation Equipment Co., Ltd.
Fig. 4-5 Open a Project
3.
: Data Recording – The button is to be used under two states:
I. Open or create a project
Click the button to show the interface in Fig. 3-7; please refer to Chapter III for
configuration of the interface.
II. Press “Start/Stop” button on the equipment during production;
Click the button to show the interface in Fig. 3-7, and please refer to Chapter III for related
configuration;
4.
: Production Configuration – Click the button to show the interface in Fig. 3-18.
Items to be configured in the interface include:
Production: multiple items; check to enable and uncheck to disable;
Platform Compensation: input platform compensation value;
Scraper Y Direction Compensation: When alignment of the equipment fails to meet the
requirement, printed solder paste may deviate. As for this, compensation value shall
be input according to deviation data. This is different for front and rear scraper.
Other Configurations: multiple items; check to enable and uncheck to disable;
5.
: Return to Zero – Click the button, and follow instructions of the software to
operate the equipment in return-to-zero operation, as is shown in Fig. 3-2, 3-3, and
3-4.
6.
: Transmission Function – Click the button to show the interface in Fig. 4-6, and the
equipment only provides transmission function, like a conveyor.
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Shenzhen Hetiangude Automation Equipment Co., Ltd.
Fig. 4-6 Transmission Interface
7.
: Resetting – Click the button to reset signals of the equipment, with no interface
activated.
8.
: Shutdown Buzzing – Click the button to shutdown alarm buzzing, with no
interface activated.
9.
: Equipment Parameter Configuration – Click the button to configure equipment
parameters, as is shown in Fig. 4-7, 4-8, 4-9, and 4-10.
Fig. 4-7 Equipment Parameter 1
Fig. 4-8 Equipment Parameter 2
Equipment Parameter I: Fig. 4-7
A. Platform – To configure axial stroke of the platform
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Shenzhen Hetiangude Automation Equipment Co., Ltd.
B. Transmission System – To configure maximum/minimum width of guide rail, the distance from
fixing board of guide rail to CCD original point, PCB in-position delay, and the distance from
guide rail center to CCD X original point, etc.
C. Printing System – To configure the stroke of scraper beam, the distance from front scraper to
fixed transmission border, maximum/minimum moving speed of scraper, and maximum pressure
of scraper.
D. Template Alignment – To adjust basic parameters of platform mathematical model; this is
precision reference, which shall only be modified by manufacturer’s professionals.
Equipment Parameter II: Fig. 4-8
This part is designed to configure video system, cleaning system, moving axes, alignment system,
product, printing compensation, etc.
Equipment Parameter III: Fig. 4-9
This part is designed to configure moving axis stroke, and different equipment configurations.
Equipment Parameter IV: Fig. 4-10
This part is designed to configure moving axis speed, acceleration, and micro-stepping number of
each round of rotation
Fig. 4-9 Equipment Parameter 3
10.
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Fig. 4-10 Equipment Parameter 4
1: Alarm Log – Click the button to show the interface in Fig. 4-11
Shenzhen Hetiangude Automation Equipment Co., Ltd.
Fig. 4-11 Alarm Log
11.
: Manual Cleaning – Click the button to show the interface in Fig. 4-12
Fig. 4-12 Manual Cleaning
12.
: Scraper Configuration – Click the button to launch the interface in Fig. 4-13; zero
position of front and rear scraper may be configured in the interface; after having
configured a program, place PCB in the middle section of transmission guide rail,
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Shenzhen Hetiangude Automation Equipment Co., Ltd.
click “Z-axis to Printing Position”, select “Inching of Scraper Axis”, click “Printing
Axis Retreat” or “Printing Axis Forward”, so as to set the tested scraper at PCB
position; click “Find Zero Pressure” of the tested scraper, and the scraper will
automatically moves down, until touching the steel screen; test the other scraper in
the same way; on this basis, lift up the scrapers and return Z-axis to zero point;
click Exit to complete the test.
Fig. 4-13 Scraper Configuration
13.
: Interface Navigation – Click the button to switch between Production Interface
and Main Interface;
14.
: Exit – Click the button to exit the system
15.
: Start – Click the button, and the system will automatically “Check if There is PCB
Board on Guide Rail”, and “Suggest if the Width of the Guide Rail needs to be
Adjusted”; successively click “Yes” or “No” to execute printing operation.
16.
: Pause – The button only acts as status prompt.
17.
: Stop – Click the button and click Confirm to stop the equipment
4.2.3 Auxiliary Menu - Function and Operation
1.
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: Click the menu in main interface to activate the interface in Fig. 4-14
Shenzhen Hetiangude Automation Equipment Co., Ltd.
Fig. 4-14 Auxiliary Menu
2.
: Operation Menu – Click Operation Menu in Fig. 4-14 to launch Operation Menu,
as is shown in Fig. 4-15
Fig. 4-15 Operation Menu
3.
: Zero Clearing – Click “Zero Clearing” menu in Fig. 4-15 and follow the instruction
to zero-clear yield
4.
: Online Operation – Click the menu once to switch to ‘
that Auto Online Generation is activated
5.
: Return – Click the button to close Operation Menu and to return to the interface in
Fig. 4-14
’ state, which indicates
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Shenzhen Hetiangude Automation Equipment Co., Ltd.
6.
: Help – Click the button to launch Help Menu, as is shown in Fig. 4-16
Fig. 4-16 Help Menu
7.
: Registration – Click the button to launch registration interface in Fig. 4-17; input
registration code here to transform the software into full version, which may be
used permanently
Fig. 4-17 Registration Interface
8.
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: Version Information – Click the button to show the interface in Fig. 4-18
Shenzhen Hetiangude Automation Equipment Co., Ltd.
Fig. 4-18 Version Information
9.
: Language – Click the button to switch software language between Chinese and
English
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Shenzhen Hetiangude Automation Equipment Co., Ltd.
Chapter V Alarm Handling
5.1 Equipment Alarm
1. Low air pressure
2. Emergency button pressed
3. Cleaning device not in original position
4. Servo motor alarm
5. Door switch alarm
6. Cleaning paper runs out
7. Cleaning fluid runs out
8. Transmission overtime, please reset
5.2 Instruction to Equipment Alarm and Handling Measure
1. Low air pressure: if the pressure of compressed air fails to meet the configured lowest limit,
or exceeds the maximum value, the software will pop up alarm message, and the three-colored
lights will turned red, with buzzer activated, as is shown in Fig. 5-1.
Fig. 5-1 Low Air Pressure
Normally, three reasons may possibly cause the situation. Please follow the below steps and
remove the causes one by one with exclusive method, until the equipment returns back to normal.
A. “Three-way Residual Pressure Valve” on pneumatic FRL is closed.
Please check if the valve is closed. If so, please open the valve. If the valve has been opened,
please refer to B for the cause.
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Shenzhen Hetiangude Automation Equipment Co., Ltd.
B. Leakage of external supply pipeline or failure of external air source (air compressor)
Please check if the air pressure gauge at lower left corner of the equipment is normal. The
normal range is 0.4~0.6MPa. If so, please refer to C for the cause. If not, please check if
external air source (air compressor) works normally, and if there is leakage with air supply
pipeline. Please eliminate all failure, until the pointer of pressure gauge is between 0.4 and
0.6MPa.
C. If the “Three-way Residual Pressure Valve” is opened, and the value shown in air pressure
gauge is 0.4~0.6MPa, while there is still alarm activated, please check signal cable of
pressure gauge for sound contact, until the alarm is all-clear, and the equipment works
normally. If the above three measures cannot solve the problem, please telephone the
manufacturer for after-sales service.
2. Alarm triggered, when emergency button is pressed, is shown in Fig. 5-2.
Please rotate the emergency button to restore the button, and to deactivate the alarm. Attention:
The equipment is designed with two emergency buttons, one on right front panel, and the other on
upper right corner of the back.
Fig. 5-2 Alarm Triggered by Emergency Button
3. Cleaning device is not in original position, as is shown in Fig. 5-3.
The problem is caused by the fact that the cleaning rack is not in the original position. Please
open the rear door of the equipment, and pull the cleaning rack back to the original position.
Afterwards, close the door, and press “RESET” button on the front panel of the equipment to reset
the equipment and to deactivate the alarm.
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Shenzhen Hetiangude Automation Equipment Co., Ltd.
Fig. 5-3 Cleaning Device is not in the Original Position
4. Servo motor alarm, as is shown in Fig. 5-4
Fig. 5-4 Driver Alarm
Such alarm information is normally triggered by overloading of servo motor. Firstly press
“Emergency Button” to cut off the power, and then check the mechanical parts of the equipment to
eliminate interference or blockage. If there is such cause, please find the reason to solve the
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Shenzhen Hetiangude Automation Equipment Co., Ltd.
problem. If there is no problem with mechanical parts, please check the cable for looseness or poor
contact. It is recommended to re-connect the plug between servo motor and its driver. When all
problems are solved, restore the emergency button, switch on the power supply, reset and zero-clear
the equipment, and re-run the program.
5. Door Switch Alarm is shown in Fig. 5-5. The situation is caused by door switch alarm’s
being enabled in Production Configuration. If the function is enabled, if any one of front and rear
door is opened, the equipment will stop working, and prompt the message: “Please close the door.”
As for this, we need to close the door, and successively press “RESET” button and “START/STOP”
button on the right front panel of the equipment, and the equipment will return to normal. If the
function is not enabled, if front or rear door is opened, working speed of the equipment will be
reduced to 1/3, which is quite dangerous. Thus, it is recommended to enable the function in
production.
Fig. 5-5 Please Close the Door
6. Cleaning paper runs out, as is shown in Fig. 5-6.
If the dialogue box shows up, the three-colored light will turn red, with buzzer activated. The
equipment stops working. There is also message noticing cleaning paper runs out. Please open the
rear door of the equipment to fill in cleaning paper, and then close the rear door. On this basis,
please successively press “RESET” button and “START/STOP” button on the right front panel of
the equipment, and the equipment will return to normal.
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Shenzhen Hetiangude Automation Equipment Co., Ltd.
Fig. 5-6 Cleaning Paper Runs Out
7. Cleaning fluid runs out, as is shown in Fig. 5-7
If the dialogue box shows up, the three-colored light will turn red, with buzzer activated. The
equipment stops working. There is also message noticing cleaning fluid runs out. Please open the
front door of the equipment to take out cleaning fluid tank, fill the tank up, replace the tank back,
and then close the front door. On this basis, please successively press “RESET” button and
“START/STOP” button on the right front panel of the equipment, and the equipment will return to
normal.
Fig. 5-7 Cleaning Fluid Runs Out
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Shenzhen Hetiangude Automation Equipment Co., Ltd.
8. Transmission overtime – please press RESET button, as is shown in Fig. 5-8.
Fig. 5-8 Transmission Overtime
There might be two causes leading to the situation:
1. There is no PCB on transmission guide rail when the motor is started.
2. In-position sensor on CCD beam fails.
Solution: Firstly check if there is PCB on transmission guide rail. If not, please place PCB at the
entrance end of transmission guide rail, and successively press “RESET” key, “START/STOP” key
according to software instruction to return the equipment back to normal production. If there is PCB,
the cause should be failure of detector sensor installed on CCD beam. Please check the wires for the
sensor to eliminate poor contact, and the height of the sensor to avoid over-height (the effective
detection range of sensor varies from the color of PCB color). If all these causes are eliminated,
while there is still alarm, please contact the manufacturer.
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Shenzhen Hetiangude Automation Equipment Co., Ltd.
Chapter VI Introduction to Newly-added
Functions
6.1 2D Solder Paste Detection Instruction
2D solder paste printing quality inspection and analysis: efficiently detect deviation, low solder
paste, omission, adhesion and other printing problems; inspect printing effect to ensure printing
quality.
6.1.1 Open 2D inspection interface and establish inspection points
1. Open created program and re-capture mark points
Fig. 6-1 Template Configuration 2
2. Click 2D Template Configuration Inspection and open 2D inspection interface
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Shenzhen Hetiangude Automation Equipment Co., Ltd.
Fig. 6-2 2D Inspection Interface
3. Click to add new record and to establish inspection points; click real-time display, and adjust
LED1 and LED2 to reach the effect in the figure.
Fig. 6-3 Real-time Display Interface
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Shenzhen Hetiangude Automation Equipment Co., Ltd.
4. Click Move, and use arrow keys on keyboard to move to the inspection position.
Fig. 6-4 Find Inspection Point
5. Click Video Capture and Template Configuration; manually set the green box in Fig. 6-5;
Fig. 6-5 Template Configuration
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Shenzhen Hetiangude Automation Equipment Co., Ltd.
6. As is shown in Fig. 6-6, after inspection points are configured, click Template Fixation
Fig. 6-6 Inspection Point Configuration
7. Click Template Fixation to display inspection point number and coordinate, as is shown in
Fig. 6-7; if there are additional points to be configured, click Add Record and repeat the above steps
after Step 3.
Fig. 6-7 Inspection Points
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Shenzhen Hetiangude Automation Equipment Co., Ltd.
8. Input the qualified coverage rate of solder paste on PCB; according to default setting, the
coverage rate of solder paste on bonding pad shall be over 60% to meet the quality requirement (i.e.
qualified solder paste/bonding pad: 0.6),
9. As is shown in Fig. 6-7. Click Confirm to complete establishing, adding and parameter
configuration of 2D Inspection Point;
10. Click Confirm to save revised data, as is shown in Fig. 6-8;
Fig. 6-8 2D Inspection Configuration Completes
11. Click Production Configuration to open production configuration interface; check 2D
Inspection, click Confirm and save the configuration.
Fig. 6-9 Production Configuration Interface
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Shenzhen Hetiangude Automation Equipment Co., Ltd.
12. Click Start Button
to activate production state; after printing operation, inspection
interface will be displayed.
Fig. 6-10 Inspection Interface
Complete!
6.2 SPC System Introduction and User Manual
6.2.1 Definitions
PPK is employed to measure process capability. PPK shall be ≥1.67 so as to begin volume
production. As for this, PPK is also referred to as initial capability index. PPK is calculated via the
minimum value of PPU or PPL, with the formula of PPU=(USL-X-bar)/3s and
PPL=(X-bar-LSL)/3s.
Many companies have a superficial knowledge of process capability, and only judge process
capability by CPK index. As a matter of fact, in regular production, the process shall be assessed by
the difference between the three indexes of CP, CPK, and PPK, and to figure out whether the
problem is related with management or technology. CP>1.33 means that process variation is quite
small, and CPK shall be analyzed. Significant difference between CP and CPK indicates that the
process has great deviation, and shall be centered. If so, CPK and PPK shall be compared. Slight
difference between the two indicates that the influence caused by special factors is limited. Major
difference between the two indicates that the influence caused by special factors is significant. As
for this, we need to figure out actual processing capability of the process under stable state, i.e. the
stable processing precision under standard conditions, such as operator, equipment, raw material,
measurement method and environment. As for this, CP, CPK, PP, and PPK will be taken as
assessment parameters.
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Shenzhen Hetiangude Automation Equipment Co., Ltd.
CP: Process capability is only used to analyze stable process, i.e. actual processing capability under
controlled state, irrespective of process deviation, and is 6σ range of inherent process deviation
(only deviation caused by ordinary reasons). σ is normally estimated by r-bar/d2 or s-bar/c4. As for
this, process capability is calculated based on short-term data of process under controlled state. For
this reason, process capability is also referred to as “short-term process capability”. In actual
practice, “short-term” is often omitted. This index only has meaning to bilateral tolerance, instead
of unilateral tolerance. The calculation formula is CP = (USL-LSL)/ 6σ.
CPK: Process capability index refers to the process capability with deviation in the process, on
condition that, there shall be stable and normally distributed process data of at least 25 groups (It is
suggested data be no less than 20 groups. Less data groups lead to higher risks), only taking into
consideration the effect of common reasons. As it is an ideal state for the process to be only affected
by deviation of common reasons, in the long run, the process will be inevitably affected by various
special reasons. For this reason, it is also referred to as short-term process capability, or potential
process capability. CPK is calculated via the minimum value of CPU or CPL, with the calculation
formula of CPU = (USL-X-bar)/3σ and CPL=(X-bar-LSL)/3σ.
PP: Process performance is actual processing capability in long-term operation, which is 6σ range
of total process deviation (deviation triggered by in-subgroup variation and inter-subgroup variation;
if the process is uncontrollable, total process deviation includes special reasons and common
reasons). In the formula, σ is normally subject to the normal distribution with mean value of μ and
standard deviation of σ2, and is estimated with standard deviation s of sample. At the moment,
whether the process is controllable is not considered. For this reason, process performance is also
referred to as long-term process capability, or performance index. Calculation formula: PP =
(USL-LSL)/6s
PPK: Calculation of process performance index is independent from stable process (for the
calculation formula has comprehensively considered common and special reasons). As for this, in
PPAP Handbook, pilot production is greatly affected by instable factors (the process is affected by
two sorts of reasons at the moment), and influence caused by special factors is easily found. Small
CP value means that the process is greatly affected by common factors. At the moment, in order to
improve process capability, more investment and better decision are required. Thus, even if CPK
value is very high (such as larger than 2), the process still needs to be improved when it is
significantly different from CP/PPK.
6.2.2 Software Operation Steps
1. Copy “CPKDataRT.exe” in U-disk to root directory of “F” disk, as is shown in Fig. 6-2-1;
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Shenzhen Hetiangude Automation Equipment Co., Ltd.
Fig. 6-2-1
2. Find a PCB and implement PCB mark point recognition process according to routine production
steps, as is shown in Fig. 6-2-2;
Fig. 6-2-2
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Shenzhen Hetiangude Automation Equipment Co., Ltd.
3. Click “Production Configuration” in main interface of HTGD software, choose according options
in the interface and click Confirm, as is shown in Fig. 6-2-3;
Fig. 6-2-3
4. Click “SPC” button in the main interface of HTGD software to launch SPC software; click
“Configuration” button in SPC software, and configure parameters in the popup dialogue box; SPC
parameters of printer shall be consistent with parameters in Fig. 6-2-4.
Fig. 6-2-4
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Shenzhen Hetiangude Automation Equipment Co., Ltd.
5. Return back to the main interface of HTGD software to make sure options in Production
Configuration are consistent with Fig. 6-2-3; click Start button in software interface, place PCB at
one end of the guide rail and start the test. Click “SPC” button in main interface of HTGD software;
sample 100 times, and obtain the results in Fig. 6-2-5 or Fig. 6-2-6.
Fig. 6-2-5
Fig. 6-2-6
Attention: The interface shown in Fig. 6-2-7 may be popped up during the test, which may be
directly neglected according to the software.
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Shenzhen Hetiangude Automation Equipment Co., Ltd.
Fig. 6-2-7
Test 100 PCS, copy Fig. E and Fig. F to word software, and print the word document.
THE END!
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Shenzhen Hetiangude Automation Equipment Co., Ltd.
Shenzhen Hetiangude Automation Equipment Co., Ltd.
Address: 132 Huangpu Road, Shangliao Community, Shajing Town, Baoan
District, Shenzhen
Tel: +86-0755-23077180
Fax: +86-0755-23077183
Http://www.sz-htgd.com
E-mail: sales@sz-htgd.com
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